Daniel Poitras
Phone: 613-990-5965
Fax: 613-952-5711
Email: Daniel.Poitras@nrc-cnrc.gc.ca

Evaporation is a common thin film deposition technique where the source material is evaporated in a vacuum, allowing vapour particles to travel straight to the substrate where they condense back to the solid state. Evaporated atoms that collide with foreign particles may react with them (reactive evaporation); for instance, aluminium deposited in the presence of oxygen will form an oxide.
The BAK system uses two sources of evaporation (thermal and electron-beam), and an assist ion-beam. The thermal source uses an electric resistance heater to melt the material and raise its vapour pressure to a useful range. The electron beam gun fires a high-energy electron beam to a small spot of the material. Since the heating is very intense, lower vapour pressure materials can be deposited. In ion-assisted deposition (IAD), the substrate is exposed to a secondary ion beam operating at low power.
The BAK system is equipped with crystal thickness monitors and a single-wavelength optical monitor. It is used for deposition of a large variety of materials, for application covering UV to mid-IR wavelength ranges.