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Rapid Thermal Annealing
Rapid thermal annealing is used to form metal contacts to semiconductors, and to heat-treat other semiconductor materials.
Three rapid thermal annealers are available in the Nanofabrication facility, a AG Associates 410, a Jipelec JetFirst and a Accutherm 610. All three are equipped with both thermocouple and pyrometer control, enabling anneal temperatures between 100°C and 1100°C. Anneal times of up to 15 minutes can be used, except at high temperatures when shorter times are required to avoid overheating problems. The AG Associates 410 can accept 100 mm (4”) wafers, while the Jipelec and Accutherm 610 can both accept 150 mm (6”) wafers. All can anneal small pieces, when a carrier wafer is used. The ambient gases available are N2, O2 and forming gas (4% H2 in N2) for both the AG Associates 410 and Jipelec, and N2 and forming gas for the Accutherm 610.
