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ADS Magnetron Sputtering Deposition System (IMS)
Sputter deposition is a vacuum physical vapour deposition (PVD) method of depositing thin films by sputtering, i.e. using energetic atoms or ions to eject material from a "target", which then deposits onto a "substrate". The availability of many parameters that control sputter deposition makes it a complex process, but it also allows better control over the growth and microstructure of the film.
The ADS uses as sputtering sources magnetrons that utilize magnetic fields to trap electrons close to the surface of the magnetron, where the target materials sit. The ions created are directed towards the surface of the target. The sputtered atoms are neutrally charged and so are unaffected by the magnetic trap. Charge build-up on insulating targets can be avoided with the use of AC or pulsed DC power supply. In so called reactive sputtering process, ADS can deposit many different dielectric films with metal and semiconductor targets.
