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Semiconductor Devices Fabrication

Nanofabrication

  • 4,000sq/ft of clean room (class 10,000/1000)
  • Direct write e-beam lithography – JEOL 6000FSE & JEOL 840
  • Contact lithography - Karl Suss MJB3
  • Maskless Optical Lithography - Intelligent Micro-Patterning SF-100
  • ICP-RIE – Oxford Instruments PlasmaLab 100
  • CAIBE - Oxford Instruments IonFab 300
  • PECVD - Oxford Instruments PlasmaLab 100 & PlasmaTherm
  • E-beam, thermal, and sputter deposition of metals – e.g. Edwards Auto-306
  • RTA – AG Associates 410, Jipelec JetFirst
  • Cleaving, thinning, and wire bonding
  • SEM – Hitachi 4700FE & JEOL 6400FE
  • AFM – Pacific Nanotechnology
  • VASE - Variable angle spectroscopic ellipsometry - Woollam
  • Stress measurement – Tencor
  • Sem-automatic Flip-Chip Bonder - Laurier M9

Building Name:

A.G.L. McNaughton Building

Building No.:

M-50

Related Information

Institutes: