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Semiconductor Material Characterization & Analysis

Characterization

  • TEM/STEM - JEOL JEM 2100F with an Oxford EDS and a Gatan EELS
  • TEM (sample preparation)
  • Gatan 691 ion polishing systems
  • Allied High Tech Products Tripod Polisher
  • Buehler precision metallurgical saw
  • VCR Group D500i Dimplers
  • FIB FEI 820 Dual Beam workstation
  • Mitutoyo lift-out tool
  • Fischione Model 1010 low angle milling and polishing system
  • SEM - Hitachi 4700FE with image processing capabilities (Northern Eclipse and Image Pro Plus)
  • SIMS - Physical Electronics Adept 1010 (with shallow-depth-profiling capability)
  • SAM - Physical Electronics 650
  • SAM - Ulvac-Phi 700
  • XPS - Physical Electronics 5500 (with <0.5 eV resolution)
  • AFM/SCM - Veeco DI Nanoscope III
  • AFM - Enviroscope Veeco DI
  • XRD (powder) - Panalytical 1820 with specular/diffuse scattering capability
  • XRD (high resolution) - Panalytical MRD with simulation software
  • XRD (high resolution) - Bruker D8 Discover (High Resolution) with in-plane diffraction and environment control capabilities
  • Raman (micro) - Horiba Jobin Yvon LabRam with microscope coupled FTIR
  • Raman (high resolution) Horiba Jobin Yvon T64000 triple monochromator
  • DEI - Dynamic Electroluminescence (~100 ps resolution & 0.5 mm spatial)
  • Spectrophotometers:
  • Perkin Elmer Lambda 19
    ○○ Perkin Elmer Lambda 900 (including reflectance)
    ○○ Perkin Elmer 983 IR
    ○○ Cary 50 UV-Visible Spectrophotometer
  • Ellipsometer (Spectroscopic) – Woollam
  • FTIR - Nicolet Nexus-470
  • DSC - TA Instrument 2050
  • TGA - TA Instrument 2010
  • Potentiostat - Solartron 1285
  • Fluorescence Spectrometer - ISA Jobin Yvon SPEXFL-3
  • PR-650 Spectracolorimeter and electroluminescence characterization facility
  • Fluorescence Microscope - Nikon Eclipse 80I
  • Contact Angle Analyzer (dynamic) - FTA200

Building Name:

A.G.L. McNaughton Building

Building No.:

M-50

Related Information

Institutes: